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Forward Components brings together component distribution and component engineering services to provide complete material solutions from the design phase through production and EOL support.

Component Engineering Services: Our Technical Sales Department will review the current specifications of your “problem” component(s) and work with your engineers to offer a long-term solution when obsolescence, lead-times, performance, or rising costs create issues that must be addressed.

BOM Analysis: We can analyze your Bill of Materials with several goals in mind. First, we do a thorough part number validation and EOL evaluation. Then, with an eye to YOUR company’s goals, we can review for performance (offering ways to enhance the performance of your product), cost-reduction (identifying ways to reduce procurement costs and increase a product’s profitability), and/or provide line item and “kitting” options. This will provide for ease of procurement, shortening and streamlining of the supply chain, and will protect the quality of your finished product by providing uniform and thorough Quality Control Processes.

Inventory Consignment: Large, stagnant inventories are the bane of many companies looking to increase profitability or increase available warehouse space. With Forward Components as a consignment partner, you can be confident that YOUR inventory is receiving both the exposure and targeted marketing that brings results. We are able to design a consignment program based on YOUR Company’s goals in regards to physical location of stock, desired return, and other considerations.

Pre-Certification: When obsolete materials must be used, more than ever before, the source and authenticity of the components destined for your circuit boards is of critical importance. Great care must be taken to assure that non-conforming parts do not make it to your production line. Not only does Forward Components utilize a very strict QC process, we also have partnered with several test houses to provide quick turnaround for parts that need to be electrically tested before reaching your dock.

Industry News:

Sunfilm to ramp tandem Applied thin film photovoltaic lines
Tue, 13 May 2008 00:00:00 PDT
Aiming to set a new solar industry benchmark by manufacturing the world’s first tandem junction, silicon thin film photovoltaic modules on 5.7-square-meter glass panels, Germany-based Sunfilm AG, which was formed last year, said today that it will purchase a second SunFab thin film solar panel manufacturing line from Applied Materials.


AMD creates central engineering organization as Rivas resigns
Mon, 12 May 2008 00:00:00 PDT
The microprocessor challenger has promoted Randy Allen to head its computing solutions group, forming a central engineering organization to be co-led by former IBM executives Chekib Akrout and Jeff VerHeul. The appointments come as AMD re-architects its business for sustained profitability on the departure of Mario Rivas, formerly executive VP of the computing solutions group, who has left AMD to pursue new opportunities, and the April resignation of CTO Phil Hester.


Applied SunFab service aims to optimize solar manufacturing efficiency
Mon, 12 May 2008 00:00:00 PDT
To guarantee the performance cost and output of its SunFab thin film equipment line for producing solar modules, Santa Clara, Calif.-based semiconductor, display and solar panel manufacturing equipment giant Applied Materials Inc today detailed its SunFab Performance Service program that aims to allow continuous cost reduction based on megawatt output.


AMD continues to withhold details on asset-lite plans
Fri, 09 May 2008 00:00:00 PDT
Despite being encouraged by financial analysts to shed some light on its business strategy as it pertains to its fabs and profitability, AMD CEO Hector Ruiz did not discuss rumors that the company will sell off its manufacturing facilities at its annual meeting of stockholders.


Pure-play foundries comprise 84% of market, IC Insights says
Fri, 09 May 2008 00:00:00 PDT
In its ranking of the top IC foundries for 2007, Scottsdale, Ariz.-based market research company IC Insights Inc reported this week that 11 of the top 14 foundries are based in the Asia-Pacific region, with only one - Europe-headquartered X-Fab, which merged with 1st Silicon in 2006 -- the only non-Asia-Pacific pure-play foundry company in the top 14 group.


TSMC, UMC April sales up y/y, q/q
Fri, 09 May 2008 00:00:00 PDT
Hsinchu, Taiwan-based Taiwan Semiconductor Manufacturing Co reported sales for April on an unconsolidated basis were up 5.8% sequentially over March, and 24.8% higher year-over-year from April 2007, while Taipei, Taiwan-based United Microelectronics Corp reported April revenue was up 4.8% over April 2007, and less than 1% higher than March sales.


Nanometrics targets solar manufacturing industry with Tevet acquisition
Fri, 09 May 2008 00:00:00 PDT
To broaden its integrated metrology product line, Milpitas, Calif.-based semiconductor metrology company Nanometrics Inc this week said it has acquired Tevet Process Control Technologies Ltd based in Yoknea’m, Israel, through an all-cash asset purchase transaction.


AMD revamps server roadmap
Thu, 08 May 2008 00:00:00 PDT
Following feedback from OEMs, microprocessor maker Advanced Micro Devices Inc detailed updates to its server roadmap to “strengthen its alignment with end-customer priorities,” by addressing platform longevity, performance-per-watt and virtualization features according to Randy Allen, AMD corporate VP and general manager for servers and workstations.


NASA supercomputer to get boost from Intel, SGI
Thu, 08 May 2008 00:00:00 PDT
Intel, SGI, and NASA have announced a project that aims to produce a dramatic increase in the space agency's supercomputing capacity.


Hynix licenses 50-nm DRAM stack technology to ProMOS
Thu, 08 May 2008 00:00:00 PDT
Confirming news reports from March, Seoul, South Korea memory giant Hynix Semiconductor Inc said today it has extended its strategic alliance with ProMOS Technologies Inc to include Hynix’s licensing 50-nm-class DRAM stack process technology to ProMOS, while ProMOS gives Hynix access to DRAM products from its 300-mm fab capacity.


AMD-Intel antitrust suit heats up
Wed, 07 May 2008 00:00:00 PDT
In the antitrust dispute between microprocessor rivals Intel and Advanced Micro Devices, the companies recently submitted preliminary pretrial briefs. In its brief, AMD presents what it says is new evidence of Intel antitrust. Intel says AMD filed the suit in the midst of a run during which it enjoyed unprecedented success in increasing its market share, its range of products, and its profits, which more recently have sagged as the result of poor business execution.


DuPont plans China photovoltaic R&D, production plant
Wed, 07 May 2008 00:00:00 PDT
To support its role in the rapidly growing photovoltaic solar energy industry, DuPont will soon begin construction on a research center in Hong Kong and a manufacturing facility in Shenzhen.


Intel, Samsung, TSMC want 450-mm wafer pilot line in 2012
Mon, 05 May 2008 00:00:00 PDT
In a push for the 450-mm semiconductor wafer size, which some in the semiconductor industry still don’t believe will actually come to fruition, three industry goliaths – microprocessor giant Intel Corp, memory leader Samsung Electronics and leading semiconductor foundry Taiwan Semiconductor Manufacturing Co – said they have “reached agreement” that the industry needs to start working together to transition to the 450-mm wafer size.


Qimonda, Centrosolar set up solar cell manufacturing JV
Mon, 05 May 2008 00:00:00 PDT
In an effort to combat rough memory market conditions by generating a new revenue stream for itself, Munich, Germany-based memory company Qimonda AG announced today that it has inked a contract with German solar company Centrosolar Group AG to jointly build, equip and operate a solar cell manufacturing plant, which will produce solar cells based on silicon.


SRC-NRI secures nanoelectronics research funding at US universities
Mon, 05 May 2008 00:00:00 PDT
Research Triangle Park, NC-based semiconductor university-research consortium Semiconductor Research Corp is reporting the most recent funding awards for the Nanoelectronics Research Initiative, a public-private partnership that aims to maintain US leadership in next-generation electronics by developing devices that leverage nanometer-scale materials properties.


Intel Atom supply squeezed
Fri, 02 May 2008 00:00:00 PDT
Intel reports better-than-expected demand for Diamondville and says it is “moving quickly” to increase output, as PC OEM Asustek Computing notes a shortage of the Atom chips.


Memory weakness masking healthy semi sales growth, SIA says
Thu, 01 May 2008 00:00:00 PDT
With weakness in memory revenue from price erosion masking the overall strength of semiconductor sales, the Semiconductor Industry Association (SIA) reported today that worldwide sales of semiconductors in Q1 reached $63.4 billion, which was 3.8% higher than $61.1 billion in Q1 2007, but 5.1% lower than $66.8 billion in Q4 2007. Excluding memory products, total semiconductor sales increased by 11% year-over-year.


SEMI: Semi equipment industry stands to lose up to $4B annually due to IP infringement
Thu, 01 May 2008 00:00:00 PDT
Semiconductor equipment and materials suppliers are facing serious and mounting challenges in regard to intellectual property protection, with adverse economic consequences possible for the entire electronics industry, according to a report by industry association Semiconductor Equipment and Materials International this week.


TSMC up, UMC down again Q/Q, SMIC exits DRAM
Wed, 30 Apr 2008 00:00:00 PDT
Hsin-Chu, Taiwan-based semiconductor foundry giant TSMC announced Tuesday that its consolidated revenue for Q1 ended March 31 was $2.9 billion, up 34.8% year-over-year, but down 6.8% sequentially, while UMC felt the pain of inventory adjustments as reflected in its Q1 financial results that showed a 13.1% sequential revenue decline to $788.4 million.


Suss MicroTec to enhance nano imprinting with Philips Research litho technology
Tue, 29 Apr 2008 00:00:00 PDT
To improve printing resolution and repeatability in semiconductor manufacturing, Munich, Germany-based semiconductor test technology supplier Suss MicroTec has licensed Philips Research’s substrate conformal imprint lithography technology that will be added to an existing equipment platform for large-area imprint applications.


NXP boosts STB biz with Conexant broadband media processor unit buy
Tue, 29 Apr 2008 00:00:00 PDT
To strengthen its digital TV and set top box business, Eindhoven, Netherlands-based semiconductor supplier NXP Semiconductors is acquiring Conexant Systems Inc’s broadband media processing business for $110 million in cash up front, and additional consideration of up to $35 million based on achievement of certain revenue milestones.


MEMC facility back online after STF leak
Tue, 29 Apr 2008 00:00:00 PDT
After a transfer line from a transport vehicle developed a leak last Thursday and caused a release of STF (silicon tetrafluoride), a raw material gas used in the manufacturing process, MEMC shut down production and sent 18 employees to the hospital. Production has been restarted and all 18 employees transported to area hospitals for evaluation and/or treatment have been released.


IBM, Matheson Tri-Gas to develop semi manufacturing materials for 32 nm and below
Mon, 28 Apr 2008 00:00:00 PDT
IBM continues to ink manufacturing agreements, this time with Matheson Tri-Gas to develop materials and processes for 32 nm and beyond. "In our business model where we pool individual research strengths and intellectual property, we are able to reduce the significant costs associated with the research required to create the next generation of chip technology,” Bernie Meyerson (pictured), CTO for IBM’s systems and technology group, said of the agreement.


Intel, Cray to develop supercomputing technologies
Mon, 28 Apr 2008 00:00:00 PDT
To help solve some of the world’s most complex scientific, engineering and humanitarian challenges, chip giant Intel Corp is teaming with supercomputer maker Cray Inc on a multi-year agreement to create high-performance computing systems from Cray, based on Intel microprocessors.


Matsushita, Pioneer form PDP alliance
Fri, 25 Apr 2008 00:00:00 PDT
To progress and reinforce the plasma display panel (PDP) business, Pioneer Corp and Matsushita Electric Industrial Co Ltd reported Thursday that they have reached a basic agreement on a comprehensive PDP business alliance that covers R&D, strategic production and supply of PDP and modules.


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Forward Components:
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Forward Components' authorized and franchised product lines:

Comm Con
Mag Layers
Taicon Capacitors
Nemco Electronics
Torex Semiconductor
Xicon Passives
American Opto Plus
Smart Modular

Comm-Conn Connectors

Comm Con Worldwide, founded in 1982, is a U.S. based designer and manufacturer of PCB board to board connectors. Comm Con offers connectors for board stacking, PC/104, EBX, CompactPCI, CPCI, Disk Drives, VME, Industry Pack, IP Module, and automotive. Comm Con has specialized in this market and as a result, has the capability to produce millions of variations of .100", .050", 2mm, 1mm, and 0.8mm spacing connectors. Comm Con also offers related products such as board spacer hardware, front panels, and ejector handles. More...